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M1 Probe Station
· The only mass production probe station in the world that can calculate the probe scrub mark in real time and determine the spatial information of probes and probe cards
· Please call Eoulu service hotline 4008808776 for professional engineer support!
Category:
Probe Station
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CONTACT NOW- Product Features
- Product Mix
- Product Parameters
- Instructions
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The only mass production probe station
in the world that can observe wafers in real time
The only mass production probe station
with a Faraday Cage in the world
The only mass production probe station in the world that
can calculate the probe scrub mark in real time and determine
the spatial information of probes and probe cards
The world's lightest 12-inch probe station, and the main body only weighs 750 kg,
makes the probe station faster and more accurate
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M1 Mechanical Performance
No Item Chuck X-axis Y-axis Z-axis Theta axis 1 Travel 301 mm 501 mm 20 mm 10◦ 2 Maximum positioning accuracy * ≤ 1 μm ≤ 0.05μm ≤ 1μm ± 0.003° 3 Speed ** ≥ 50 mm/s ≥ 50 mm/s ≥ 20 mm/s / 4 Maximum speed 150 mm/s 150 mm/s 35 mm/s / 5 Wafer roughness adaptability * 100 μm 6 Average time of mapping *** Minimum value Typical value Maximum value < 500 ms <1s <3 s **** * When C0 and VR are enabled
** The speed at which M1 chuck moves varies depending on the chuck size chosen by the customer, the chuck construction (Coax or Triax), and whether the chuck supports high and low temperatures
*** This time only refers to the mechanical movement time and does not include alignment time. There will be some variation depending on the size of the DUT, movement precision, and stability requirements
*** High speed and high stability cannot be achieved simultaneously. Eoulu can provide services to optimize test accuracy or test speed according to the customer's wafer and measurement application. For more information, please contact sales for hardware and software upgrade solutions
**** In the case of 12-inch, room temperature, and triax chuck, F1 adopts the highest accuracy and most stable speed mode, 1000 μm * 1000 μm chip movement timeM1 Shielding Capability
No. Shielding and Noise Capability * 1 Light attenuation ≥ 150 dB ** 2 EMI shielding ≥ 20 dB 0.5-20 GHz (typical) 3 Spectral noise floor ≤ -150 dBVrms/rtHz (≤ 1 MHz) 4 System AC noise ≤ 15 mVp-p (≤ 1 GHz) * In addition to the system capability, environmental conditions should also be considered. This project is not verified on the client side, and can be arranged to be verified in Suzhou laboratory of Eoulu; During the verification process, install the shield enclosure when there is no testing machine.
** The test light path refers to the perpendicular incident light from 90° directly above the microscope
** The light shielding wavelength is 200 ~ 2000 nmM1 Vibration Isolation Capability （Option）
No Vibration Isolation Capability * 1 Natural frequency (vertical) 2.5~2.7 Hz 2 Natural frequency (horizontale) 2.0~4.5 Hz 3 Vertical damping (adjustable) 6%~20% 4 Horizontal damping 5%~6% 5 Air pressure 0.3~0.5 Mpa 6 Maximum load 1600 kg 7 Isolation efficiency 5%~6% 8 Response time to external excitation <1s 9 Vibration isolation level VC-C * Only when the specified damping valve option is selected in the M1 configuration can there be the vibration isolation capability. There are no such parameters for the configurations without the damping valve or the ordinary damping valve. For the vibration isolation table related parameters, please refer to the manufacturer traceability index. This project is not verified on the client side
M1 Microscope
No. Front Real-time observation microscope 1 Number of CCD or CMOS 3 2 Travel 12.5 mm 3 Feature resolution <2 μm 4 Maximum speed 5 mm/s 5 Typical magnification * 500 ~ 2000X or higher 6 Typical optical lens resolution ** The physical resolution is 11 μm, imaging calculation is enhanced to
5.5 μm or smaller7 Imaging calculation 10 Eoulu' s Copyright Algorithm No. Back Microscope 1 Number of CCD or CMOS 1 2 Travel The same as chuck 3 Feature resolution <2 μm 4 Maximum speed 5 mm/s 5 Typical magnification * 200X or higher 6 Typical optical lens resolution ** 4.5 μm 7 Imaging calculation 3 Eoulu' s Copyright Algorithm * When the CCD configuration is different, the color and magnification will be different
** When the lens configuration is different, the resolution will be differentM1 Chuck
No Item 12-inch 1 Temperature range Room temperature High and low temperature 2 Maximum operating
temperature range *- -60~300C 3 Typical temperature range ** - -60~150C
-60~200C
-60~300℃
-40~150C
40~200C
-40~300C
0~100C
0~200°C
Room temperature ~ 150C
Room temperature ~ 200C
Room temperature ~ 300C4 Temperature accuracy ±1°C 5 Temperature resolution 0.1°C 6 Triax chuck leakage (non-thermal) ≤ 231 fA 7 Triax chuck noise (non-thermal) ≤ 42 fA 8 Cooling mode Liquid cool and air cool are optional 9 Typical transition time ***
(Liquid cool)- 60°C → 25°C：23 min
25°C → 300°C：28 min
300°C → 25°C：25 min
25°C → - 60°C：37 min10 Typical transition time ***
(Air cool)- 60°C → 25°C：9 min
25°C → 300°C：25 min
300°C → 25°C：12 min
25°C → - 60°C：29 min11 Maximum heating power 5.5 kW 12 Maximum cooling power 12.5 kW 13 Maximum refrigerant flow 5 m/s 14 Maximum transport pressure 4 bar 15 Maximum heating powerMaximum voltage
(high power option) ****10000 V 16 Maximum current
(high power option) ****800 A 17 Statement ·It shall be operated and stored strictly in accordance with the temperatureand humidity specified in "Environmental conditions" in this Manual.
·Before the probe station leaves the factory, wafers shall be placed on chuck for performance verification and reliability test. Therefore, the scratches on the surface of chuck or the movable plate cannot be completely avoided.The scratches do not affect the use of the probe station and are not considered as a quality problem.
·Before the thermal probe station leaves the factory, heating and cooling test shall be conducted on the thermal system and thermal chuck.Therefore, the baking marks on the surface of the chuck (e.g. chuck color change and water vapor mark)cannot be completely avoided. The baking marks do not affect the use of the equipment and are not considered as a quality problem.18 Cleaning ·Clean the probe station once a month. Use a soft dust-free cloth to remove the dirt from chuck.If lots of dust and debris are generated during use,cleaning frequency shall be increased.
·Do not use isopropyl alcohol(IPA) or any other chemicals on the chuck, as improper useof solvents or grinding agents may damage the probe station.19 Maintenance ·No items can be placed on the chuck except the device under test.
·If the screws are loose, promptly tighten them carefully and evenly according to the torque requirements. If necessary, contact the Eoulu's service team for treatment.
·For the fully-automated probe station, ensure that the power supply has been properly shut down during maintenance or when not in use, and ensure they do not accidentally restart before maintenance is completed or before use.20 Service ·For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year.
·The following services can only be executed by Eoulu's team:- Leveling and calibration of the chuck X/Y/Z/Theta stage
- Disassembly and installation of the chuck
21 Eoulu high performance
thermal Chuck
* Users can choose in these temperature ranges according to test requirements
** For other temperature ranges, please contact Eoulu's sales
** The larger the temperature range, the higher the purchase cost. Testing below room temperature requires cooling, and the lower the temperature,the higher the purchase cost. Please select the appropriate temperature range according to the actual test requirements
*** Measured in 20°C~24°C , 40%~50% humidit
*** High voltage and high current cannot be reached at the same time
*** Higher voltage or higher current need to be customizedM1 Loader
Loader Specifications 1 Travel R-axis 630 mm θ -axis 340° Z-axis 300 mm 2 Average handling speed R-axis 430 mm/sec θ -axis 240°/sec Z-axis 180 mm/sec 3 Maximum handling speed R-axis 640 mm/sec θ -axis 340°/sec Z-axis 250 mm/sec 4 Resolution R-axis within 10 μm θ -axis 0.0015° Z-axis 2 μm 5 Repetition accuracy ± 0.1 mm 6 End-effector Bottom supported vacuum adsorption type Calibrator Specifications 7 Calibration accuracy Within ± 0.1 mm in the center of the wafer，
and within ± 0.1° for the notched of the wafer8 Calibration time ≤ 3 s Operating Efficiency Of Wafer Loading And Unloading（Operating Speed 35%） 9 First Load 79 s 10 UnLoad 58 s 11 Next Load 46 s M1 Control Software future interface (futureI)
No. Item futurel function 1 Single-page operation Included 2 Autofocus Included 3 2 Points Align Included 4 Auto Align Included 5 AutoZ Included 6 High speed AutoZ Optional 7 Twin-rudder operation * Microscope and chuck movement 8 futureI interface * 
9 futureI and Eoulu integration
software futureC seamless
connection makes test easier *
10 futureI and Eoulu data software
futureD seamless connection makes
data processing easier *
No. Item M1 1 Typical dimensions (W x D x H) ~ 1650 x 1600 x 1560 mm * 2 Main dimensions 
3 External view 
4 Weight Probe station Thermal system（Liquid Cooling） ~ 750 kg ~ 245 kg 1 Environmental conditions Operating ·Ambient temperature: 17°C ~ 25°C, ± 0.5°C
·Relative humidity: 20% ~ 60%Storage ·Ambient temperature: 10°C ~ 30°C
·Relative humidity: ≤ 50%
·Storage time: ≤ 6 months
(When the storage time exceeds 6 months,it needs to be powered on for 24 hours)Ambient vibration
(including floor)·On the horizontal floor, equivalent uniform live load ≥ 200 kg/㎡
·Maximum level 100 micrometers/sec,rms (ISO Operating Theatre level) *
·Laboratory cleanliness: General laboratory
(The requirements for the F1 operating and storage environment
described in this Manual must be met)
Recommended to be placed in Class-10,000 clean room and above **2 Power Semi-automated probe station ·Probe station: single-phase 220 VAC ( +7%, -10%) ***,50/60 Hz, 1800 VA, GB 10A socket
·LCD, computer host, and vacuum pump: single-phase 220 VAC (+7%, -10%) ***,50/60 Hz, 1000 VA, GB 10A socket (3-way, power strip)Fully-automated probe station ·Probe station: single-phase 220 VAC (+7%, -10%) ***, 50/60 Hz, 1800 VA, GB 10A socket
·LCD, computer host, and vacuum pump: single-phase 220 VAC (+7%, -10%) ***,50/60 Hz, 1000 VA, GB 10A socket (3-way, power strip)
·Loader: single-phase 220 VAC (+7%, -10%) ***, 50/60 Hz, 1000 VA, GB 10A socketThermal system ·Controller: single-phase 220 VAC (+7%, -10%) ***, 50/60 Hz, GB 10A socket
·Chiller (Liquid cool): three-phase 380 VAC (+7%, -7%) ***, 50/60 Hz, GB 32A 5-core aviation socket
·Chiller (Air cool): three-phase 380 VAC (+7%, -7%) ***, 50/60 Hz, GB 32A 5-core aviation socket3 Clean Dry
Air ******
（CDA）Room-temperature probe station ·Air pressure: 4.5 ~ 8 bar (65 ~ 116 psi)
·Dew point: ≤ -20°C
·Connector *****:
Semi-automated: 8 mm OD (CDA 1)
Fully-automated: 8 mm OD (CDA 1) and 8 mm OD (CDA 2)High and low-temperature probe station Testing at low and high temperatures, the following conditions must be met to keep Chuck frost-free:
·Air pressure: 4.5 ~ 8 bar (65 ~ 116 psi)
·Continuous flow:
Liquid cool: ≥ 100 l/min @ 4.5 bar
Air cool: ≥ 400 l/min @ 4.5 bar
·Dew point: ≤ -70°C (when the lowest test temperature is -60°C)
·Oil less than 0.01 mg/m³ ****
·Connector *****:
Semi-automated: 8 mm OD (CDA 1)
Fully-automated: 8 mm OD (CDA 1) and 8 mm OD (CDA 2)4 Vacuum ****** Air pressure(absolute vacuum) ·≤ 0.4 bar @ 10 l/min Air pressure (relative vacuum) ·≤ - 0.6 bar @ 10 l/min Continuous flow ·≥ 10 l/min Connector ***** ·Semi-automated: 8 mm OD (VAC 1)
·Fully-automated: 8 mm OD (VAC 1) and 8 mm OD (VAC 2)5 Accessories Air compressor Temperature range (liquid cool) Room temperature -60 ~ 150°C -60 ~ 200°C -60 ~ 300°C -40 ~ 150°C -40 ~ 200°C -40 ~ 300°C 0 ~ 100°C 0 ~ 200°C Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C Vacuum pump - Service category Service content Part Number Hardware service
(Installation)• System installation (mass production mode) SRV-301 • System installation (analysis mode) SRV-501 • Accessory installation SRV-305 • System reinstallation SRV-306 • Instrument connection SRV-307 • Ground connection SRV-308 Hardware service
(Calibration)• Accuracy calibration SRV-503 • Temperature calibration SRV-505 • Loader calibration SRV-506 Hardware service
(Training)• Probe station operation (mass production mode) SRV-303 • Probe station operation (analysis mode) SRV-502 • RF calibration SRV-202 • Instrument operation SRV-203 Hardware service
(Others)• Probe station PM PM-F1 • Probe station relocation RELO-F1 • Accompanying service SRV-201 Software service
(Installation)• On-site installation SRV-101 • Remote installation SRV-103 Software service
(Update)• Platform function SRV-607 • Platform version SRV-606 • Test script SRV-608 • Instrument driver SRV-609 • Plug-in update SRV-701 Software service
(Training)• Software operation SRV-605 • Driver development SRV-603 • Script development SRV-702 Software service
(Others)• Operation consultation SRV-706 • Troubleshooting SRV-703 • Accompanying service SRV-705 Application service • IV test SRV-707 • CV test SRV-708 • RF test SRV-709 • SiPh test SRV-801 • Blue tape test SRV-802 • Fixture test SRV-803 • MMIC test SRV-805 • Automatic test SRV-806 Delivery service • Urgent service SRV-807 • Insurance SRV-808 • Unloading SRV-809 • Exclusive vehicle SRV-901 • Storing SRV-902 • Upstairs delivery SRV-903 • Cleanup SRV-905 * For details of service quotation, please contact Eoulu's sales.
Product parameters are subject to change without prior notice.All product images are subject to the actual products, and Suzhou Eoulu System Integration Co., Ltd. reserves the interpretation right for the content.
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